PCB Design for Media Streaming
Mobile devices for harsh environments
The Tech
Our client came to us for help developing a customised processor card for a mobile video streaming device.
Complex technology in a small form factor, the product needed matched impedance’s technologies and minimal component packaging. It also needed to be durable and able to withstand harsh environments.
Our Brief
We were asked to identify the right PCB design technology and manufacturing requirements for a 1mm pitch 896 pin BGA.
Getting the positioning of connectors and the mechanical features correct was vital to ensure first time fit.
We were also tasked with identifying all high speed design rules, impedance, skew groups and differential pairs.
Our Approach
We researched the application and design guidelines for the BGA part including the recommended breakout.
Using high speed design software, we implemented and confirmed that the design met all high speed rules.
We derived the PCB manufacturing rules based on production quantities with the PCB manufacturer.
3D modelling and analysis were carried out to ensure right first time fit into design enclosure.
And IPC7351A compliant footprints were provided for high density packaging to allow for global manufacturing capability.
The Results
The resulting PCB Design fit first time into the required form factor.
Performance-wise, the PCB met high-speed requirements, differential impedance and skew.
And the client achieved a high manufacturing yield due to it meeting production requirements.
"This was the first time we have developed a processor PCB with high speed constraints. Quantum guided us through the process from capturing design rules and working with our PCB supplier to create the optimum layerstack.
The design worked first time with a high manufacturing yield."
Director, Device Engineering