PCB Design for Digital Health
PCB design for a handheld blood sugar monitor
The Tech
Our client was developing a device, which would help patients manage diabetes on a day-to-day basis.
The technology consists of an insulin pump, which wirelessly connects to a slim touchscreen handset. Providing instant feedback via a blood glucose meter app, this consolidates data centrally. And the resulting information helps healthcare professionals and patients highlight blood sugar triggers.
Our Brief
The handset had to be discreet so the design was as small as possible.
Given its size, we would need to use High Density Interconnect (HDI) technologies and small component packaging to meet requirements.
Perfecting the PCB design would be critical. This would guarantee first time fit for all connections and mechanical features within the limited space.
Our Approach
Working within strict design rules, we researched the application and design guidelines for the Package on Package (PoP) elements.
Collaborating closely with CEM, we assessed the pros and cons of solder and non-solder mask defined pads.
We then identified the right technology and manufacturing requirements for the 0.4mm pitch Package On Package (PoP) BGAs. Via in pad, stacked blind vias.
Liaising with our PCB manufacturer, we derived HDI PCB manufacturing rules based on the production quantities.
And to comply with industry requirements and allow for global manufacturing, we provided IPC7351A compliant footprints for high density packaging.
The Results
The resulting PCB designs met all critical performance standards, achieving high-speed requirements, differential impedance and skew.
The PCBs were optimised for manufacturing – reducing transportation costs through high density designs.
And they fit perfectly first time, thanks to our use of 3D modelling and analysis during design.
"From the first prototype build, we had a product that was ready for production. I would not hesitate in recommending Quantum CAD to anyone."
Director, Device Engineering